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Architecture of Thales Alenia Space future avionics as well as methods and tools for its development, integration and verification will be specified during this project. This includes:
OBC-core specification with its variability to cope with various missions needs including LEO, MEO, GEO and interplanetary exploration missions. And:
For FPGA fabric:
For Boot and Hardware Dependent Software:
For Application Software:
The overall study is accompanied by product assurance and quality for:
One challenge of this study consists in defining the development logic for this new generation computer while following the NG-ULTRA SoC development in parallel to activities for definition and validation of Avionics, Hardware, IPs, Software and ACE.
In addition, the NG-ULTRA offers a high computing power together with very large FPGA capacity interconnected through high speed AMBA bus. Functions insured by several chips in the current platform computers can hence be integrated on a single chip allowing significant cost saving.
Functions allocation among Hardware, FPGA and Software while keeping good dependability level represents one the main challenge of the study.
The main benefits brought by the product are, from a commercial point of view, the increased competitiveness, through reduced recurrent cost, mass and consumption.
On top of that, the product will offer a high flexibility thanks to the reprogrammable FPGA and to the high computing power and partitioned software capability allowing integration in the On-Board Software additional application software functions for future needs.
The product is a platform avionics with the On Board Computer based on multicore SoC and eFPGA: NG-ULTRA/DAHLIA.
It supports platform subsystems (Attitude and Orbit Control, Power, Propulsion, Thermal) through Avionics Centralized Electronics (ACE) and High Power Unit (HPU), and interfaces the Payload via numerical bus and discrete links.
Avionics main units are developed on a modular approach giving high flexibility and growth potential for future applications including LEO, MEO, GEO and interplanetary exploration missions.
ACE gathers interchangeable modules for:
Thanks to its modular architecture, ACE could also integrate dedicated modules for specific mission needs.
HPU gathers high power modules such as:
OBC includes powerful R52 quadri-core ARM-based MPSoC as well as the largest space FPGA. This allows avionics function integration on a single chip. In addition OBC integrates hardware and software for handling of RF signals directly from GNSS antennas.
Furthermore an OBC extension module may be added for specific mission needs.
Refer to Product features.
Main project milestones are:
The complete set of documentation is available with a few exceptions that will be delivered for Milestone 2 completion.
Project is foreseen to be extended to cover the OBC-D FUMO manufacturing, HW SW integration and tests.