The design of PCB (Printed Circuit Board) is constrained by the thermal management of the most dissipative components. Indeed, as only conductive heat transport is available, it is required that the most dissipative components be placed close to the PCB thermal interface. Moreover, conductive links, as thermal straps, are used in order to insure the specified temperature on high dissipative component (close to 10 W).
Less dissipative components are pushed away to hotter zones of the PCB leading to degraded reliability figures and a lay-out not optimized in terms of performance.
The recent progress made in the technology of Loop Heat Pipes (LHP), where stable heat transport can be achieved with input powers of 10Watts or less, make it a potentially interesting technique to relieve the design of PCB for the constraints above.
The application reference case is a cooling of electronic devices in Small Modular Processor application. The objectives of this activity were to identify the most suitable LHP technology, to define and justify the solutions retained, to manufacture, integrate and test the models and to compare to the initial reference design.