The cooling system is composed by:
Thermo-Electric Cooling element/s mounted outside the LNA hermetic sealing (in order to reduce the impact on the standard
process for qualification of the LNA itself)
temperature sensor mounted as close as possible to one of the critical elements inside the LNA hermetic sealing to monitor the
temperature reference point and used to control the power input to the TEC system
a control electronics, which finds allocation in the available space within the Interconnection Module behind the LNA, reading the reference temperature and then controlling the input to the TEC allowing then the temperature control of the LNA. The TEC is positioned in order to maximize its cooling capacity with respect to the elements to be cooled inside the LNA, the temperature
sensor as close as possible to the component in order to provide a perfect monitoring of the system. The electronic board is as compact as possible, although designed to be able to control the complete assembly of LNAs on the Interconnection Module (4 elements) and has a limited power consumption to reduce its impact on the overall architecture.